Imprint Planarization Layer

For those applications where imprinting on substrate topography is necessary, the SFIL process is modified to include an imprint planarization step, as described here. The current material for this planarization layer is a mixture of ethylene glycol diacrylate (Aldrich), t-butyl acrylate (Aldrich), and Darocur 1173 (Gelest).

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Last updated Thursday, March 20, 2003
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