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Development of 157 Photoresist Materials The purpose of this document is to provide timely public access to the 157 nm resist development work being done in our laboratories under contract from International SEMATECH.It is our goal and SEMATECH's goal to disseminate this information as rapidly and widely as possible in hope that doing so will accelerate the availability of 157 nm resist materials to the members of International SEMATECH.
Dissolution Inhibitors Along with our work to create polymer structures for 157 photoresists, we have explored compounds as dissolution inhibitors. This approach will allow us to formulate a photoresist as a three-component system. Carbon monoxide copolymers are one of the component choices. We have synthesized and examined several compounds as the dissolution inhibitor properties. Recent dissolution inhibitor work: Poster displayed at the 2001 2nd Annual 157 Symposium in Dana Point: CANorbornene-Carbon Monoxide Copolymerization & Dissolution Inhibitor Study ACS SW Regional presentation: Dissolution Inhibitors for 157nm Lithography SPIE 2003: Dissolution Inhibitors for 157nm Lithography Below is a summary of the experiments.
Future Work More inhibitors We will synthesize and test 1,3- analogues of 1,4-HFAB derivatives as shown below.
We will test if alkoxymethyl ether groups work to inhibit the dissolution of a polymer that has hexafluoropropanol moieties, since we learned that the hexafluoropropanol moiety tends to make some form of a complex with ethers.
Our exploration to find efficient dissolution inhibitors does not stop at this point. We will seek out more compounds and test their properties of solubility, inhibition, and absorbance. Imaging work We will test our materials including carbon monoxide copolymers as dissolution inhibitors by imaging in the near future. Version History
Original page created 05/21/01
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