Eui Kyoon (EK)
Kim
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Graduate
Student - Chemical
Engineering
Office: CPE 3.154
Phone: (512)-471-6364
Email: eui@che.utexas.edu
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EK received his B.S. degree in Chemical Engineering from the
Seoul National University in February, 1996. Then he enrolled in
the Chemical Technology graduate program at the Seoul National
University, and received Master of Science in Engineering in
February, 1998. He began his doctoral work under the guidance of
Professor C. Grant Willson in September 1999. After completing
his Ph.D., he will be employed by Applied Materials in Santa
Clara, California.
Research Areas:
- Imprint materials (acrylate, vinyl ether)development
- Vinyl ether and epoxy monomer synthesis
- Material properties (mechanical, surface and thermal
properties) evaluation
and characterization.
- Temperature simulation in imprint material and electron
beam resist.
- Surface treatment (glass mold and polymer)
Publications and Presentations
(1) E. K. Kim et al., "Importance of Evaporation in the
design of
Materials for Step and Flash Imprint Lithography" J. Vac. Sci.
Tech. B., 23
1515-1520 (2005).
(2) M. D. Dickey et al., "A Study of the Kinetics of Step
and Flash
Imprint Lithography Photopolymerization" AICHE J. 51 2547-2555
(2005).
(3) M. D. Stewart et. al., "Direct Imprinting of
Dielectric Materials
for Dual Damascene Processing" Proc. SPIE 5751 210-218 (2005).
(4) E. K. Kim et. al., "Vinyl Ethers in UV curable
Formulations for Step
and Flash Imprint Lithography" J. Vac. Sci. Tech. B., 22 131-135
(2004) and
presented at the EIPBN 2003 conference.
(5) S. Johnson et. al., "Step and Flash Imprint
Lithography Modeling and
Process Development" J. Photopolym. Sci. Tech. 17 417-420
(2004).
(6) R. L. Burns et al., "Mesoscale modeling for SFIL
simulating
polymerization kinetics and densification" Proc. SPIE 5374
348-360 (2004).
(7) S. C. Johnson et. al., "Advances in Step and Flash
Imprint
Lithography" Proc. SPIE 5037 197-202 (2003).
(8) J. Jang and E. K. Kim, "Corrosion Protection of Epoxy
coated Steel
using Different Silane Coupling Agents" J. Appl. Polym. Sci.,
71, 585-593
(1999).
(9) E. K. Kim and C. G. Willson, "Thermal analysis for
Step and Flash
Imprint Lithography during UV curing process" Microelectronic
Eng. accepted.
(10) E. K. Kim et al., "Vinyl Ether Formulations for Step
and Flash
Imprint Lithography" J. Vac. Sci. Tech. B. Submitted and
presented at the
EIPBN 2005 conference.
(11) G. M. Schmid et al., " Implementation of an imprint
damascene
process for interconnect fabrication" J. Vac. Sci. Tech. B.
Submitted and
presented at the EIPBN 2005 conference.
(12) M. P. C. Watts et al., "Low viscosity high
resolution patterning
material" US Patent 20030235787 (2003).
(13) K. Wu et. al., "Effect of interfacial surfactants on
template
release in imprint lithography" presented at the 229th ACS
National meeting
(2005).
(14) M. D. Dickey et al., "Tailoring Photopoymerization
materials for
Nanotechnology" presented at the 228th ACS National meeting
(2004).
(15) K. Wu et al., "Interfacial Surfactants and
Surfactant Segregation to
Enable Template Release in Imprint Lithography" Presented at the
AICHE
Annual meeting (2004).
(16) S. C. Johnson et al., "Photopolymerization Induced
Shrinkage in Step
and Flash Imprint Lithography" Presented at the AICHE Annual
meeting (2004).
(17) T. C. Bailey et. al., "Recent Advances in Step &
Flash Imprint
Lithography" presented at the Interface Symposium (2002).
(18) N. A. Stacey et. al., "Recent Advances in Step &
Flash Imprint
Lithography" presented at the NNT conference (2002).
Awards
Samsung Paper Contest, the second place, Samsung Austin
Semiconductor, Dec. 2000
Full Resume
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